Application:
Moving in line with the fast development of micro-electronics, the production of PCBs has advanced to a direction of multi-layered technology, functionalization and integration.
In order to satisfy the demands for high-end copper plating which vertical plating fail to satisfy, such as High Aspect Ratios, Deep, Blind Hole plating and PCB horizontal pulse copper plating . Our high purity Copper oxide powder contains low impurities and is extremely stable. It can guarantee the purity of the plating solution by compensating copper ions rapidly and consistently.
Properties:
Toxic; irritate;Comparative density:6.32(Powder) ;Insoluble in water; soluble in weak acid;
Advantages:
1. Our advanced production techniques ensures that our product has a high content of copper, low organic
impurities and chloride which guarantees high stability.
2. Our unique desiccation technique produces subtle crystals with a high dissolution speed without bubbling
effects.
3. It can be used directly in the supplementation of copper salts in the production process. As there is no need
to deal with the impurities, it guarantees economization and stability in the horizontal copper plating
Process.
Technical specifictions:
|
Test Items |
Specifications |
|
Assay (%) |
≥ 99.3% |
|
Chloride(Cl- ) |
≤ 10ppm |
|
Iron(Fe) |
≤30ppm |
|
Lead(Pb) |
≤ 5ppm |
|
Zinc(Zn ) |
≤ 30ppm |
|
Nickel(Ni ) |
≤ 10ppm |
|
Calcium(Ca) |
≤ 100ppm |
|
Magnesium（Mg） |
≤ 100ppm |
|
Manganese （Mn） |
≤ 10ppm |
|
Dissolving speed (s) |
≤ 30 |
|
Insoluble matter in acid |
≤ 30ppm |
Molecular weight: 79.54 CAS No.: 1317-38-0
Appearance: Blackish brown powder Packaging: 25kg/barre
