Application:
It is the main compound of the tin plating process in methane sulfonic acid (MSA) systems and the source of stannous ions in the plating solution.
Due to its low corrosive properties, simple wastewater treatment, high stability, wide current density, fine crystallized coating, high welding ability and high oxidation resistance, it is widely used for high speed plating of plug-in units, PCBs, connectors, capacitors, resistors and other electronic components and IC products. It is an environment-friendly plating material.
Properties:
With irritating odor and strong acidity; At 390~407 degrees centigrade, it decomposes into SnSO4, while 407-425 degrees centigrade it decompose into SnO.
Advantages:
1. Advanced production technique ensures high tin content and acid ions and high stability of bivalent tin.
Low content of quadrivalent tin, organic impurity, metallic impurity ions, etc, guarantees a high stability of
our products.
2. Having high stability bivalent tin, together with appropriate additives can maintain a long usage lifespan.
3. With fine plating ability, high dispersion and deposition speed, it can be adopted in a wide range of
different electricity density.
4.With low metallic and non-metallic impurities and high purity of plated coatings, it can prevent joints from
Color changes under extreme heat when used in the electronic SMT jointing technique.
Technical specifictions:
|
Test items |
Specifications |
|
Stannous tin, Sn2+ |
19.5~20.5% |
|
Total tin |
19.5~21.5% |
|
Stannic tin, Sn4+ |
≤0.7% |
|
Free MSA (as CH3SO3H) |
5.5~7.5% |
|
Sulfate (SO4 2-) |
≤500 ppm |
|
Choride (Cl-) |
≤50 ppm |
|
Lead (Pb) |
≤20 ppm |
|
Iron (Fe) |
≤10 ppm |
|
Cobalt (Co) |
≤5 ppm |
|
Nickel (Ni) |
≤5 ppm |
|
Zinc (Zn) |
≤5 ppm |
|
Copper (Cu) |
≤10 ppm |
Molecular weight: 308.91 Appearance: colorless or yellow transparent liquid
CAS No.: 53408-94-9 Packaging: 20L/drum, 200L/drum, 5gallons/drum,30kg/drum


