Application:
It is the basic raw compound and the source of Cu2+ in copper plating solutions. The JHD cupric chloride is so pure that harmful metallic ions, organic impurities and insolubles are eliminated effectively, lest the catalytic reaction caused by such impurities would reduce the stability of the plating solution. Due to its high quality, it can be used as a base coat in non-metallic plating, PCB hole metallization and electro-magnetic shielding of electronic instruments.
Properties: Easily deliquesce; toxic; the aqueous blue solution has weak acidic properties; when heated, it decomposes and turns into alkaline saltCu(OH)2·CuCl2.
Advantages:
1. Our advanced production techniques ensures that our product has a high content of copper, low
Metallic ions and organic impurities, which guarantees high stability.
2. Applications( Mainly used in copper plating and PCB etching)
A)Without infusing metallic impurities, it prevents the occurrence of catalytic reactions which leads
to metallization of the bath, PTH hole break; high consumption of copper salts; imbalance of the
plating solution etc.
B)Without infusing organic matters, it maintains the stability and extends the usage life-span of the
Bath solution.
C)High purity guarantees the efficient velocity of copper deposition and the etching speed.
D)High diffusion ensures that the plating is even and smooth.
Technical specifictions:
|
Test items |
High purity |
Extra-pure |
|
Assay (CuCl2·2H2O) |
≥97.0% |
≥99.0% |
|
Arsenic (As) |
≤4 ppm |
≤4 ppm |
|
Iron (Fe) |
≤10 ppm |
≤10 ppm |
|
Zinc (Zn) |
≤10 ppm |
≤10ppm |
|
Lead (Pb) |
≤10 ppm |
≤5 ppm |
|
Cobalt(Co) |
≤10 ppm |
≤5 ppm |
|
Chromium (Cr) |
≤10ppm |
≤5 ppm |
|
Cadmium (Cd) |
≤10 ppm |
≤5 ppm |
|
Turbidity (53.7g/100mL),NTU |
≤25 |
|
Molecular weight: 170.48 CAS No.: 1344-67-8
Appearance: Bluish green orthorhombic crystals Packaging: 25kg/bag (PE bag)


